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SENZPAK provides volume manufacturing capabilities for various types of sensors that are assembled calibrated and tested in standard and non-standard packages suitable for end user applications.
The final package outline can be a SOIC, PDIP, LCC, Z-Axis package, MCM, flip chip, or COB assembly.
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Processing Capabilities (Technology Enablers)
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Die to die – wire bonding
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Stack die, low force placement
(20 grams)
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Gold, aluminum and copper wire capability
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Multiple component assembly on modules, substrates and systems
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Customer specific MCM solutions
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Flip chip capability
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Solder ball placement arrays to substrate
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Precision eutectic component attach
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High resolution machine vision
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Precision force control
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Pick and place capability to intermediate carriers, precision alignment
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In-line stencil printing with high speed component placement equipment (Universal GSM1), with in-line reflow and inspection (Heller) up to a 20 x 20 stencil arrangement
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Solder ball application to laminate substrates, PCB and wafer level application
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Continuity testing
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Automated fluid dispensing
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Solder paste
Epoxy
Encapsulation
Under-fill
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Interconnect process capability from 90 to 60 microns
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Dicing saw systems that have the capability to saw silicon to substrates
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Processing Services
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Offering MEMS/MST value added assembly high density interconnect substrates, modules, MCMs, COB, hybrid, BGA, CSP, flip chip and customised packages.
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Specialised capability in industry
specific markets
Consumer
Bare die chip shooting
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Multiple fabrication techniques and processes can be combined into a single package with the appropriate silicon and substrate technology to increase packaging bandwidth
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Communication
Flip chip fine pitch ribbon bonding
Automotive
Multi-die application
Industrial
Hybrids |
Packages
SPF 1
Cavity Plastic Packages
SOIC/PDIP/LCC
Pressure sensors, accelerometers, relays, microphones
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SPF 2
Z Axis Packages
Accelerometers
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SPF 3
Specialized Form Factors
Pre-molded Plastic Cavity Packages, Ported Plastic Cavity Packages
Pressure sensors
Point Of Use
Automotive applications, commercial barometric applications and industrial applications
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SPF 4
Conventional Semiconductor
Package Assembly
CSP/BGA
Point Of Use
Generic assembly for the semiconductor industry
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SPF 5
MCM, C/L/D, MCP
Multiple component packaging, hybrid packaging – FR4, laminates, LTCC substrates, thick film
Point Of Use
Application specific semiconductor and sensor assembly |
SPF 6
COB/SMT Assembly
FR4, flex, semi-rigid flex, ceramic, LTCC
Point Of Use
Sensor and semiconductor assembly
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SPF 7
Optical Assembly Product Processing
Sawing (fused silica), die attach, wire bonding, SMT, chip alignment
Point Of Use
Silicon submounts and optical drive heads
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SPF 8
CIB – Chip In Board
Advanced MCM assembly, flip chip MEMS based
Point Of Use
Mass storage
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SPF 9
Module Packaging Systems, Value Added Packaging, OEM Packaging
Substrates, housings, box builds
Point Of Use
Thermopile array modules and IR camera
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SPF 10
CSP For MEMS
Wafer scale MEMS packaging, leadframe and substrate based CSP design for MEMS
Point Of Use
All commercial and developmental sensor markets
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SPF 11
Metal Cans TO5, TO8, TO18/46, TO39
Conventional sensor assembly in standard and ported metal can products, stainless steel packaging
Point Of Use
Thermopiles and pressure sensors
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Services
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Process and Placement
Screen printing
Material dispensing
Pick and place
Odd form components
Through hole
Solder paste reflow
Aqueous cleaning, board washing
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Services and Support
PNP, sawing, interconnecting
Systems applications
Surface mount lab
Product quality
Training
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