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SensFab’s approach to manufacturing MEMS based products in high volume and at a low cost is by pursuing
the path of lean manufacturing through simplicity and the standardisation of processes by well characterised
design rules.
Pivotal components of the products are standardised into platform technology – these platforms “MemSenz™”,
enable the manufacturing of a wide range of products within each platform.
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Platform Technology
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| MEMSENZ™ is a technology platform that may consist of 4 major components |
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MEMSENZ™ I
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MEMSENZ™ II
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MEMSENZ™ III
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MEMSENZ™ IV
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Transduction Principle
Capacitive |
Transduction Principle
Piezoresistive |
Transduction Principle
Resistive |
Transduction Principle
Capacitive |
Processing Technology
Bulk/Deep RIE |
Processing Technology
Bulk/Deep Wet Etch |
Processing Technology
Surface |
Processing Technology
Bulk |
Actuation Mechanism
Force (External) |
Actuation Mechanism
Pressure (External) |
Actuation Mechanism
Thermal |
Actuation Mechanism
Sound |
Signal Condition
Two chips/Single chip |
Signal Condition
Two chips/Single chip |
Signal Condition
Two chips |
Signal Condition
Two chips |
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